It is qualified for water resistant and heat resistant wood glue. The dispersion exhibits an outstanding rapid increase in bond strength when pressed at temperature higher than 20°C. On hot press application, it shows accelerated increase of bond strength, making it most suitable for the short contact lamination of panels with laminate sheet finishing and for best forming finishes of panel edges and profiles. It also gives excellent bonding strength to wood joining. Its bond exhibits an outstanding heat and water resistant.